Doctor of Philosophy (PhD), Wright State University, 2020, Engineering PhD
Different additive manufacturing (AM) methods including fused deposition modeling
(FDM) and piezoelectrical drop on demand (DOD) inkjet printing have been used in printed
electronics for easy production, easy integration, better performance, and low cost. These
methods have been used in producing everyday smart printed electronics such as conformal
antennas (planner and non-planar antennas), sensors, actuators, and solar cells created
on flexible and rigid substrates. The performance of printed electronics strongly depends
on printing techniques and printing resolution that enhance their electrical and mechanical
properties. In this dissertation, 3D and surface printing techniques were used to enhance
the performance of printed electronics devices fabricated on rigid and flexible substrates.
First, fused deposition modeling (FDM) technique was used to study the effect
of 3D printed heterogeneous substrates on radio frequency response of microstrip patch
antennas. Microstrip patch antennas created on acrylonitrile butadiene styrene (ABS) substrates
that were designed by 3D CAD design software (SOLIDWORKS) with dimension
50mm x 50mm x 5mm and fabricated with different machine infill densities 25%, 50%,
and 75% using FDM 3D printer. Then, 3D X-ray microscope was used to measure the
actual volume fraction and construct equivalent simulations for series and parallel equivalent
dielectrics constant. The patch antennas were tested for resonant frequency using
a vector network analyzer (VNA) combined with ANSYS-HFSS simulation that was developed
based on the permittivity anisotropy in 3D printed heterogeneous substrates to
estimate the bulk permittivity of ABS material and study the effect of varying the dielectric
constant in lateral and thickness direction. Also, microstrip patch antenna with dimension
30mm x 25mm, was modeled on polydimethylsiloxane (PDMS) substrate with the same
dimension of ABS substrate and analyzed for resonant frequency using A (open full item for complete abstract)
Committee: Ahsan Mian Ph.D. (Advisor); Raghu Srinivasan Ph.D. (Committee Member); Hong Huang Ph.D. (Committee Member); Henry D. Young Ph.D. (Committee Member); Amir Alfalahi Ph.D. (Committee Member)
Subjects: Mechanical Engineering