MS, University of Cincinnati, 2002, Engineering : Electrical Engineering
In this work, we present a simple method for bonding micromachined glass biochips. Our approach relies on medical-grade UV-cured adhesives and UV-transparent substrates. The adhesive polymerizes forming the bond between two substrates when cured by a UV-source and the UV-transparent substrates enable the passage of UV-light through them to the adhesive. Using this method, several biochips were fabricated with UV-transparent low-cost microscopic glass cover slips. Microchannels were fabricated using standard fabrication procedures such as e-beam evaporation, photolithography, and wet etching. Commercially available 150 cP UV-cured adhesive was spin coated to a bare substrate at room temperature. The bare substrate was capped with the substrate containing the channels and a UV-source of intensity 7 mW/cm2 cured the adhesive at the interface for 4 min, enabling the formation of an adhesive bond. Following fabrication, the biochips were packaged and tested with colored dye and the channels were found to be leak-proof. Several tests were performed to characterize the bonding process including adhesive thickness analysis, adhesive removal analysis, bond strength analysis, reversibility test, re-packaging test, sterilization test, and lifetime test. The bonding approach has several advantages including room-temperature processing, reversibility, rapid 4-min bonding, a high process yield nearing 100%, and biocompatibility. Further, the use of low-cost glass substrates enables a cost-effective approach, disposability, and transparency. To demonstrate this method, fluid-delivery biochips were fabricated for an application involving tissue-culture. In this biosystem, the chemical stimuli used for stimulating tissue-engineered implants are delivered through these biochips. Using a computer controlled syringe pump, we automate and control flow rates and volumes of chemical stimuli flowing through the biochips, thus monitoring tissue growth.
Committee: Dr. Ian Papautsky (Advisor)
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