Doctor of Philosophy, The Ohio State University, 2023, Electrical and Computer Engineering
Lithium niobate (LN) has attracted significant interest over the past few decades as a potential platform for next generation nonlinear optical devices, high speed optical interconnects and modulators, and quantum light sources. Sub-micrometer thick lithium niobate on insulator (LNOI) is a promising integrated photonic platform that provides optical field confinement and high optical nonlinearity useful for state-of-the-art electro-optic modulators, wavelength converters, and acousto-optical devices. With fabrication foundry technologies enabling realization of low loss LNOI waveguides, devices fabricated using LNOI substrates and have been able to achieve record high harmonic generation efficiencies, and low insertion and propagation losses.Fabrication of LNOI on a silicon substrate through ion-slicing is advantageous for enabling velocity matching between microwave and optical copropagating fields in electro-optic modulators and for electronic-photonic integration but is challenging because of debonding and cracking due to thermal expansion coefficient mismatch between silicon and LN. Moreover, current techniques to pattern low loss waveguides with smooth sidewalls in LNOI rely on chemical mechanical polishing and electron beam lithography. Chemical mechanical polishing can result in film etching thickness variations, while electron beam lithography is not suited for high throughput production.Lastly, current schemes for fiber to chip edge coupling rely on the use of specialty optical fibers, such as lensed fibers, and there is a requirement for an efficient packaging solution that can utilize standard single mode cleaved optical fibers.
Fabrication of thin film lithium niobate on insulator on a silicon handle wafer is achieved via ion-slicing, informed by structural modeling, and facilitated by accommodating for dissimilar wafer bows using a bonding apparatus. Structural finite element analysis of strain energy and stress, due to thermal expansion coefficient (open full item for complete abstract)
Committee: Ronald Reano (Advisor); Patrick Roblin (Committee Member); Robert Lee (Committee Member); Fernando Teixeira (Committee Member)
Subjects: Electrical Engineering; Electromagnetics; Engineering; Nanotechnology; Optics