Doctor of Philosophy, The Ohio State University, 2021, Electrical and Computer Engineering
The solar energy industry has been growing rapidly due to decreasing costs of manufacturing and increasing panel efficiencies. As the industry dominant crystalline Si solar cell technology approaches its fundamental efficiency limits, new strategies for achieving higher efficiency while maintaining low cost is a necessity to continue the industries growth. The only demonstrated way to surpass the fundamental single junction efficiency barrier is through the use of multijunction photovoltaic cells. The multijunction cell architecture splits the solar spectrum to be absorbed by two or more different semiconductor materials with the highest energy photons being absorbed by the wider bandgap top cells, and lower energy light being absorbed by the narrower band gap bottom cells. This technology has been very successfully demonstrated in the III-V materials system and scaled by the space solar industry; however, terrestrial power generation has much stricter requirements on production cost than the space solar industry.
Thus, arises the potential for an interesting marriage of technologies. Imagine combining the highly scaled Si manufacturing infrastructure, the low-cost Si wafer materials, and high efficiency III-V multijunction cells. This is the precise combination present in III-V/Si tandem solar cells. To date, two fabrication methods, mechanical stacking and surface activated wafer bonding, have demonstrated impressive 3-junction solar cells with efficiencies of 35.9%[1] and 34.1%[2] respectively. The issue is that these techniques are not largely considered scalable for terrestrial scale power generation; however, these prototype devices demonstrate great promise for this III-V/Si device architecture. The most scalable method of III-V/Si integration is through the use of epitaxy to monolithically integrate the III-V and Si solar cells; however, this approach can lead to defect formation due to differences in the lattice parameter, crystal structure, and th (open full item for complete abstract)
Committee: Steven Ringel (Advisor); Tyler Grassman (Advisor); Sanjay Krishna (Committee Member)
Subjects: Electrical Engineering; Energy; Engineering