Doctor of Philosophy (PhD), Wright State University, 2023, Electrical Engineering
Since their invention in 1958, Integrated Circuits (ICs) have become increasingly more complex, sophisticated, and useful. As a result, they have worked their way into every aspect of our lives, for example: personal electronic devices, wearable electronics, biomedical sensors, autonomous driving cars, military and defense applications, and artificial intelligence, to name some areas of applications. These examples represent both collectively, and sometimes individually, multi-trillion-dollar markets. However, further development of ICs has been predicted to encounter a performance bottleneck as the mainstream silicon industry, approaches its physical limits. The state-of-the-art of today's ICs technology will be soon below 3nm. At such a scale, the short channel effect and power consumption become the dominant factors impeding further development. To tackle the challenge, projected by the ITRS (International Technology Roadmap for Semiconductors) a thinner channel layer seems to be the most viable solution. This dissertation will discuss the feasibility of using 2D (two-dimensional) materials as the channel layer. The success of this work will lead to revolutionary breakthroughs by pushing silicon technology to the extreme physical limit.
Starting from graphene in 2004, 2D materials have received a lot of attention associated with their distinct optical, electrical, magnetic, thermal, and mechanical properties. In the year 2010, IBM demonstrated a graphene-based field effect transistor with a cut-off frequency above 100 GHz. The major challenge of applying graphene in large-scale digital circuits is its lack of energy bandgap. Other than carbon, a variety of graphene-like 2D materials have been found in various material systems, like silicene, germanene, phosphorene, MoS2, WS2, MoSe2, HfS2, HfSe2, GaS, and InS, etc. Among all the 2D materials, silicene appears to be the most favored option due to its excellent compatibility with standard silicon technology. Simil (open full item for complete abstract)
Committee: Yan Zhuang Ph.D. (Advisor); Ray Siferd Ph.D. (Committee Member); Junghsen Lieh Ph.D. (Other); Marian K. Kazimierczuk Ph.D. (Committee Member); Saiyu Ren Ph.D. (Committee Member); Henry Chen Ph.D. (Committee Member)
Subjects: Chemical Engineering; Chemistry; Electrical Engineering; Engineering; Materials Science; Nanoscience; Nanotechnology; Packaging; Physics; Quantum Physics; Solid State Physics