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ucin1027950500.pdf (754.07 KB)
ETD Abstract Container
Abstract Header
ROOM TEMPERATURE ADHESIVE BONDING TECHNIQUE FOR MICROFLUIDIC BIOCHIPS
Author Info
DIVAKAR, RAMGOPAL
Permalink:
http://rave.ohiolink.edu/etdc/view?acc_num=ucin1027950500
Abstract Details
Year and Degree
2002, MS, University of Cincinnati, Engineering : Electrical Engineering.
Abstract
In this work, we present a simple method for bonding micromachined glass biochips. Our approach relies on medical-grade UV-cured adhesives and UV-transparent substrates. The adhesive polymerizes forming the bond between two substrates when cured by a UV-source and the UV-transparent substrates enable the passage of UV-light through them to the adhesive. Using this method, several biochips were fabricated with UV-transparent low-cost microscopic glass cover slips. Microchannels were fabricated using standard fabrication procedures such as e-beam evaporation, photolithography, and wet etching. Commercially available 150 cP UV-cured adhesive was spin coated to a bare substrate at room temperature. The bare substrate was capped with the substrate containing the channels and a UV-source of intensity 7 mW/cm2 cured the adhesive at the interface for 4 min, enabling the formation of an adhesive bond. Following fabrication, the biochips were packaged and tested with colored dye and the channels were found to be leak-proof. Several tests were performed to characterize the bonding process including adhesive thickness analysis, adhesive removal analysis, bond strength analysis, reversibility test, re-packaging test, sterilization test, and lifetime test. The bonding approach has several advantages including room-temperature processing, reversibility, rapid 4-min bonding, a high process yield nearing 100%, and biocompatibility. Further, the use of low-cost glass substrates enables a cost-effective approach, disposability, and transparency. To demonstrate this method, fluid-delivery biochips were fabricated for an application involving tissue-culture. In this biosystem, the chemical stimuli used for stimulating tissue-engineered implants are delivered through these biochips. Using a computer controlled syringe pump, we automate and control flow rates and volumes of chemical stimuli flowing through the biochips, thus monitoring tissue growth.
Committee
Dr. Ian Papautsky (Advisor)
Pages
87 p.
Keywords
MEMS
;
microfluidics
;
bonding
;
glass etching
;
UV-micromachining
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Citations
DIVAKAR, R. (2002).
ROOM TEMPERATURE ADHESIVE BONDING TECHNIQUE FOR MICROFLUIDIC BIOCHIPS
[Master's thesis, University of Cincinnati]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1027950500
APA Style (7th edition)
DIVAKAR, RAMGOPAL.
ROOM TEMPERATURE ADHESIVE BONDING TECHNIQUE FOR MICROFLUIDIC BIOCHIPS.
2002. University of Cincinnati, Master's thesis.
OhioLINK Electronic Theses and Dissertations Center
, http://rave.ohiolink.edu/etdc/view?acc_num=ucin1027950500.
MLA Style (8th edition)
DIVAKAR, RAMGOPAL. "ROOM TEMPERATURE ADHESIVE BONDING TECHNIQUE FOR MICROFLUIDIC BIOCHIPS." Master's thesis, University of Cincinnati, 2002. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1027950500
Chicago Manual of Style (17th edition)
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Document number:
ucin1027950500
Download Count:
1,565
Copyright Info
© 2002, all rights reserved.
This open access ETD is published by University of Cincinnati and OhioLINK.