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Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs)

Jo, Yea Jin
http://orcid.org/0000-0001-7026-3779
http://rave.ohiolink.edu/etdc/view?acc_num=case1727295586388394

Abstract Details

2024, Master of Sciences (Engineering), Case Western Reserve University, Materials Science and Engineering.
The long-term durability of fexible printed circuit boards (PCBs) is essential for the microelectronics industry. The adhesive layer between the polyimide and the cop- per layers is of particular concern as failure in bonding properties leads to deadhe- sion and loss in performance. In this study, three groups of multilayer coupons with different combinations of polyimide, adhesive, and copper, were subjected to 1000 h of damp heat exposure (85 ◦C/85 %RH). The degradation pathway was modeled in a < Stressor|Mechanism|Response > framework using network structural equation modeling (netSEM). netSEM degradation modeling was used to visualize and predict the extent of materials degradation according to identifed degradation mechanisms and investigate the impact of the presence of copper on the adhesive bonding performance. Therefore, the inclusion of copper in the stack resulted in weakening of the interfacial adhesion and the identifed degradation pathway includes moisture and copper diffu- sion through the adhesive.
Laura Bruckman (Committee Chair)
Roger French (Committee Member)
Ina Martin (Committee Co-Chair)
75 p.
Materials Science
Polymer degradation, polyimide, interfacial adhesion, delamination, accelerated testing, netSEM, degradation pathway models

Recommended Citations

Citations

  • Jo, Y. J. (2024). Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs) [Master's thesis, Case Western Reserve University]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=case1727295586388394

    APA Style (7th edition)

  • Jo, Yea Jin. Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs). 2024. Case Western Reserve University, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=case1727295586388394.

    MLA Style (8th edition)

  • Jo, Yea Jin. "Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs)." Master's thesis, Case Western Reserve University, 2024. http://rave.ohiolink.edu/etdc/view?acc_num=case1727295586388394

    Chicago Manual of Style (17th edition)

case1727295586388394
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© 2024, some rights reserved.Creative Commons License Data-Driven Degradation Study of Interfacial Adhesion Under Accelerated Aging: Adhesively Bonded Cu and Polyimide in Flexible Printed Circuit Boards (PCBs) by Yea Jin Jo is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 3.0 Unported License. Based on a work at etd.ohiolink.edu.
This open access ETD is published by Case Western Reserve University School of Graduate Studies and OhioLINK.
Release 3.2.12