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Study of Microchip Power Module Materials with Mini-Channel Heat Exchanger

Cole, Andrew N.
http://rave.ohiolink.edu/etdc/view?acc_num=dayton1264007133

Abstract Details

2009, Master of Science (M.S.), University of Dayton, Engineering Mechanics.
Micro-chip power capacities are rapidly increasing while the heat dissipation methods slowly advance. Thus, chip thermal conditions and the related mechanical properties need to be investigated. Selection of the optimal material combinations and attachment methods are critical for future requirements. A test stand has been developed that incorporates a mini-channel heat exchanger with round channels, and a copper block with stem as the heat input. Employing the combination of mini-channel heat exchanger with the heater allows for a known heat flux to be imposed. Future work with the optimization of module materials for SiC devices requires that the heat transfer and flow characteristics for the heat exchanger be understood thus this project is the characterization of the heat exchanger. The experimental conditions applied to the system are intended to simulate a SiC device with an estimated 100 W/cm2 of waste and an operation temperature limit of 200 °C. Imposed heat flux levels have been observed to be in the range 70-160 W/cm2 with interface temperatures below 100 °C. Lastly, computational fluid dynamics are used to simulate the flow and heat transfer within the mini-channel heat exchanger for a few flow rates to compare to the experimental data.
Jamie Ervin, PhD (Committee Chair)
Kevin Hallinan, PhD (Committee Member)
Jain Vinod, PhD (Committee Member)
134 p.
Technology
mini channel heat exchanger

Recommended Citations

Citations

  • Cole, A. N. (2009). Study of Microchip Power Module Materials with Mini-Channel Heat Exchanger [Master's thesis, University of Dayton]. OhioLINK Electronic Theses and Dissertations Center. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1264007133

    APA Style (7th edition)

  • Cole, Andrew. Study of Microchip Power Module Materials with Mini-Channel Heat Exchanger. 2009. University of Dayton, Master's thesis. OhioLINK Electronic Theses and Dissertations Center, http://rave.ohiolink.edu/etdc/view?acc_num=dayton1264007133.

    MLA Style (8th edition)

  • Cole, Andrew. "Study of Microchip Power Module Materials with Mini-Channel Heat Exchanger." Master's thesis, University of Dayton, 2009. http://rave.ohiolink.edu/etdc/view?acc_num=dayton1264007133

    Chicago Manual of Style (17th edition)

dayton1264007133
1,318
© 2009, all rights reserved.
This open access ETD is published by University of Dayton and OhioLINK.