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Degree

PhD, University of Cincinnati, Engineering : Materials Science, 2004.

Abstract

Plasma polymerized fluorocarbon (PPFC) films were deposited onto various silicone rubber substrates, including O-rings, to decrease oil uptake. Depositions were performed using a radio frequency (rf)-powered plasma reactor and various fluorocarbon monomers, such as C2F6, C2F5H, C3F6, and 1H,1H,2H-perfluoro-1-dodecene. PPFC films which were most promising for inhibiting oil uptake were deposited with 1H,1H,2H-perfluoro-1-dodecene, and were composed predominantly of perfluoromethylene (CF2) species. These films displayed low critical surface energies (as low as 2.7 mJ/m2), and high contact angles with oil (84), which were correlated with the amount of CF2 species present in the film. For the films with the highest degree of CF2 (up to 67 %), CF2 chains may have been oriented slightly perpendicular to the substrate and terminated by CF3 species. Adhesion of the PPFC films directly to silicone rubber was found to be poor. However, when a plasma polymerized hydrocarbon interlayer was deposited on the silicone rubber prior to the fluorocarbon films, adhesion was excellent. O-rings coated with multilayer fluorocarbon films showed 2.6 % oil uptake after soaking in oil for 100 hrs at 100 C. Due to variability in data, and the low quality of the industrial grade silicone rubber, the oil uptake mechanism was determined to be from oil flowing through flaws in the film due to defects within the substrate, not from generalized diffusion through the film. This mechanism was confirmed using higher quality silicone rubber, which showed little or no oil diffusion. Therefore, this film may perform well as an oil-repelling barrier when deposited on a high quality silicone rubber.

Subject Headings

Engineering, Materials Science

Keywords

plasma polymerization; thin film deposition; surface engineering; fluorocarbon; surface energy; oil diffusion

Advisor

F Dr. James Boerio

Pages

252p.

Document number: ucin1085442499
Permalink: http://rave.ohiolink.edu/etdc/view?acc_num=ucin1085442499

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